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ptc windchill

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Published By: IBM     Published Date: Mar 17, 2009
PTC, the Product Development Company® today announced that Samsung Electronics Co., LTD (SEC), a leading digital products manufacturer of mobile phones, televisions, and semiconductors, has selected PTC Windchill as its digital product development data repository to manage an integrated BOM of mechanical, electrical and software data across its globally distributed product development environment. Windchill is the standard enterprise PLM solution at SEC because of its powerful, Web-based support of key product development processes on a single technology architecture and execution environment.
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ibm, telelogic, samsung, ptc windchill, press release, electronics industry, product development, global bom, product lifecycle management, content management, dynamic publishing, enterprise applications
    
IBM
Published By: IBM     Published Date: Mar 17, 2009
IBM and PTC, leaders in product development and innovation, are offering joint solutions that combine our expertise and technology to fully support cross-enterprise product development optimization. Together, we enable companies to meet time-to-market, cost-reduction and quality requirements, in an ever-increasing, complex global marketplace.
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ibm, ptc, telelogic, product development, product innovation, joint solutions, product lifecycle management plm, return on investment, roi, ptc product development system, pds, windchill plm system, product content, intellectual property, service oriented architecture, soa, enterprise resource planning, erp, service level agreements, slas
    
IBM
Published By: IBM     Published Date: Mar 24, 2009
Electronics and Software Engineering are quickly merging with traditional Mechanical Engineering to create a new paradigm in auto manufacturing: Mechatronics. Industry experts predict that this shift will bring about profound advances in automotive product development. Unfortunately, existing IT and process infrastructures do not provide sufficient capabilities to support the new paradigm: multiple data silos, a lack of standardized processes, and integration issues on a tool level (Mechanical, Electronic, Software) continue to pose serious obstacles to development efficiency, and remain a frequent source of delays, quality issues and cost increases.
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ibm, ibm telelogic, automotive system design, mechanical engineering, mechatronics, oems, electronic stability programs, esp, electric overlay steering, ancillary systems, active lighting, pdm, product data management, pcb-layout domains, ptc, automotive product development system, sourcing, engineering, engineering change orders, ecos
    
IBM
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