Cookie policy: This site uses cookies (small files stored on your computer) to simplify and improve your experience of this website. Cookies are small text files stored on the device you are using to access this website. For more information on how we use and manage cookies please take a look at our privacy and cookie policies. Some parts of the site may not work properly if you choose not to accept cookies.

sections
Home > HP and AMD > IDC Whitepaper: Improving Power and Cooling Efficiency in the Data Center
 

IDC Whitepaper: Improving Power and Cooling Efficiency in the Data Center

White Paper Published By: HP and AMD
HP and AMD
Published:  Nov 16, 2011
Type:  White Paper
Length:  11 pages

HP has been a pioneer in incorporating technology to improve energy efficiency and reduce total cost of ownership (TCO) for IT systems in the datacenter, with solutions designed to reduce server management costs, increase utilization, and improve power and cooling.

With the launch of its new Data Center Smart Grid in June 2010, HP is continuing to push the boundaries of what its technology can deliver. A central aspect of the Data Center Smart Grid is Thermal Logic, a holistic approach to improving power and cooling efficiency in the IT infrastructure, designed to help companies reduce energy consumption, reclaim unused datacenter capacity, and extend the life of their datacenter.



Tags : 
data center, tco, total cost of ownership, power and cooling, cool, power, data center, infrastructure, consumption, thermal logic